Vitrified bonded diamond grinding wheel for optical glass sapphire wafer

Price:
Negotiable
minimum:
Total supply:
Delivery term:
The date of payment from buyers deliver within days
seat:
Beijing
Validity to:
Long-term effective
Last update:
2017-07-25 21:35
Browse the number:
52

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Company Profile

Zhengzhou Jiawei Superhard Material Co.,LTD

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Contact: zzjiawei(Mr.)

Telephone:

Area: Beijing

Address: Beijing

Website: http://zzjiawei.qq268.net/

Product details

Model Number: 14E1 Brand Name: Jiawei Key Specifications/Special Features: The affect of grinding silicon wafer: during the first manufacturing, thick silicone can reduce the damageBefore assembly, wafer thinning, good heat dissipationImproved mechanical strength (thinning and becoming softer, reduce stress.)Improve electrical properties (short connection)Reduce the workload of the scribingCharacteristics of machining of silicon wafer:1. Surface quality: demand uniform grinding lines, no edge collapse, debris, scratch and more.2. Machining accuracy: TTV<5 μm and more (total thinning veracity)3. Processing quality: surface roughness: < 10nmDamage layer thickness: < 10μm

Shipping Information:

FOB Port: China (Mainland)
Lead Time: 7 - 15 days

Main Export Markets:

Asia
Australasia
Central/South America
Eastern Europe
Mid East/Africa
North America
Western Europe